Θερμοαγώγιμη πάστα 4.0g Nedis COOLP400SI
Θερμοαγώγιμη πάστα 4.0g Nedis COOLP400SI
Thermoconductive CPU paste, 4gr. Suitable for application in CPU, UPS, inverter, chipset and other computer components
- High stability and reliability
- Low thermal resistance
- High conductivity for heat transfer
- Thermal conductivity:>4.63 W/mk
- Thermal Resistance: <0.0087°C-in²/W
- Viscosity: 12500
- Operating Temperature: -30 - 280°C
- Content: 4gr
Dimensions (cm)
9.5
2
18.5
* The above dimensions refer to the packaging .
Materials
Silver
Packaging Details
1
0.1 Kg
9.5x2x18.5
Packaged
